Advance IC Packaging Engineer

June 1, 2022

Job Description

Key Qualifications

  • – Typically requires at least 5+ years experience in Semiconductor Packaging Design, Process and New Product Introduction.
  • – Strong knowledge and R&D experience in IC packaging, SIP Module packaging, single die packaging and heterogeneous package integration.
  • – Hands on experience in various wafer level, package level assembly process, materials, and equipment
  • – Strong IC packaging materials background including characterization and failure analysis.
  • – Problem solver with strong engineering physics. Willing to tackle tough problems.
  • – Ability to work independently and work with multi-functional teams.

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