Packaging & Quality Engineer – Semiconductor

September 1, 2022

Job Description

Key Qualifications

  • – The ideal candidate should have experience in Packaging engineering or has a background in substrate manufacturing and failure analysis
  • – Minimum of 8 years of experience in semiconductor packaging or process integration
  • – Have experience managing a project of NPI qualification, package developments
  • – Good interpersonal skills and good spoke English
  • – Have strong leadership skills
  • – Willing to travel to support builds across Asia

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