- 5+ years demonstrated ability leading Research and Development initiatives developing high-end PCB, IC Substrate or Advanced Packaging technology solutions
- Strong technical fundamentals in high-end PCB production, materials and processes
- Ability to effectively communicate and collaborate with multi-functional teams
- Proven project management capability – delivering large, sophisticated projects on time, to specification
- Extensive Industry network at senior / executive management level
- Attention to detail and a strong passion for quality
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