8+ years experience working on Surface Mount Technology or Solder Ball Attach process at electronic packaging industry.
5+ years experience working with subcontractors to develop equipment, materials, and process.
Experience with transition from development to production ramp of consumer, high volume manufacturing.
Work closely with subcontractor and internal cross functional teams – Product Design, Test, Electrical Engineering, Product Engineering, and Operations.
Ability to work with international teams and travel.
