SMT In Region Process Engineer

August 19, 2022

Job Description

Key Qualifications

  • 8+ years experience working on Surface Mount Technology or Solder Ball Attach process at electronic packaging industry.
  • 5+ years experience working with subcontractors to develop equipment, materials, and process.
  • Experience with transition from development to production ramp of consumer, high volume manufacturing.
  • Work closely with subcontractor and internal cross functional teams – Product Design, Test, Electrical Engineering, Product Engineering, and Operations.
  • Ability to work with international teams and travel.

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